| A longitudinem onus sectionem mm B altitudo TRADUCTOR CUNICA mm C summa missionis sectionem mm D longitudinem missionis sectionem mm E-altitudinis diverticulum ad sectionem inclinare mm F-latitudo TRADUCTOR CUNICA mm G altiore TRADUCTOR longitudinem mm H altitudo a pavimento usque ad TRADUCTOR imo mm Ego angulus in sectione inclinatio °
Situs coegi dispositionis in sectione missionis in directum ad materiam chip vel chunky portandam in: eiciam dextrum latus eiciam sinistram partem coegi imperium ONERO custodibus vicissim switch subitis-off switch
Tooling modi conversus in torno Milling EXERCITATIO Molendum Alius
Quantum Swarf Kg/h dm³/h | Chip stultum Continuus Amount of swaff per cycle kg
Swarf material Steel ferrum mitte Aluminium Brass Alius
Swarf Special Brevis eu <8cm Long eu>8cm Chip bundle Chip et pieces
Requiritur motricium nexum 3×230V/50Hz/60Hz 3×380V/50Hz/60Hz 3×400V/50Hz/60Hz 3×480V/50Hz/60Hz
Praesto potestate voltage of the Tabula transibit: 110V/AC 24V/DC | Processus infectum: Coolant tristique facultatem L Moles coolant copia L/min
Genus coolant Oil mm²/s@40℃ Emulsion mm²/s@40℃
Coolant exitum Front Audi Lateralis Utrimque
Coolant Pump： Pump facultatem L/min Pump pressura bar Pump facultatem L/min Pump pressura bar
Alia facultas: Level switch Bin full Bin inanis Overflow prevents
Option: Chip bin |
Post tempus: Mar-09-2022